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With a very high tensile modulus of elasticity, this material adds considerable rigidity for applications needing high stiffness The material is used typically as a ground (GND) plane in the circuit If 1 GND is used it must be in the center If two are used then they do not need to be in the center, but they must be symmetrical within the stackup Three can be used if one is in the center and the other two are symmetrical in relation to each other, and so forth, with even GNDs symmetrically placed and the last (odd) GND in the centerThis does add height to the circuit Also the Dk is higher at 1336, but since the usage is as GND, that does not negatively affect the electrical performance of the circuit.

Fig 518: An open rectangular or T-shaped configuration [9, 10]

Holes not connected to the GND must be predrilled and back-filled to provide clearance from the plane (which is entirely conductive, as opposed to laminate cores, which are conductive only on the foil surfaces) The extra processing, extra layers, and cost of the material make this a specialty solution for specific applications needing high heat dissipation or very low CTE or very high stiffness..

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Materials Summary Material properties affect PWB operation in important ways The preceding discussion focused on thermal and electrical properties The use of small, high-aspect-ratio holes, thick boards, and high-power devices drives the need for materials with improved thermal properties The transition to LFA requires materials with high thermal stability Similarly, the use of high-speed devices, including the RF circuits in wireless applications, drives the need for improved electrical performance Materials exist with improved properties, but the ideal material that combines low cost with improved thermal and electrical properties does not exist Therefore, the designer must consider the needs of each design before selecting a costeffective material The need for improved thermal properties includes a material with high Tg, low CTE, high thermal decomposition temperature, long time to delamination, and low moisture absorption Polyimide meets the first four needs at the expense of increased moisture absorption and high cost.

BT satisfies all these needs, but cost remains an issue The most economical solutions are the multifunctional epoxies and the epoxy-PPO blends Multifunctional epoxies are relatively inexpensive, provide a significant improvement in Tg, and, in some cases, provide small improvements in thermal degradation temperature and moisture absorption The PPO blends provide significant improvement in all areas at a slightly higher cost If moisture absorption is an issue, the PPO blend may be the best choice For LFA the RoHS-compliant formulations may be necessary Both BT and PPO-epoxy boards provide small improvements in electrical properties If the real need is to reduce Dk so that the board thickness can be reduced, these materials may be useful However, if dielectric loss is a serious problem, the only real solution is to use PTFE Unfortunately, PTFE is very expensive and difficult to process, so it should be specified only where absolutely necessary.

This 16-bit register contains the prescaled value of the 16-bit Timer/Counter1. To ensure that both the high and low bytes are read and written simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary register (TEMP). This temporary register is also used when accessing OCR1A and ICR1. If the main program and also interrupt routines perform access to registers using TEMP, interrupts must be disabled during access from the main program or interrupts if interrupts are re-enabled. (Figure 3.17.) TCNT1 Timer/Counter1 Write: When the CPU writes to the high-byte TCNT1H, the written data is placed in the TEMP register. Next, when the CPU writes the low-byte TCNT1L, this byte of data is combined with the byte data in the TEMP register, and all 16 bits are written to the TCNT1 Timer/Counter1 register simultaneously. Consequently, the high-byte TCNT1H must be accessed first for a full 16-bit register write operation.

For example, RF circuits will nearly always require PTFE The ceramic-PTFE blends used in a hybrid construction may be the most cost-effective solution for these applications..

The construction of the rigid multilayer ML-PWB can take on many variations. To help categorize the various constructions, the IPC has developed industry PWB design specifications, defining them by class and type. Grouping the ML-PWB into categories facilitates the ability of designers and fabricators to communicate using a common format.

type guideway combinations, and Figure 521 shows an example of a guideway employing rolling elements to reduce friction In addition, Figure 522 illustrates a precision lathe with a guideway containing foundry sand for enhanced stability

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