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The chief disadvantage with a clad outer layer design is in the potential for lower yield. This is because the external copper foil must be protected by the image mask during all the FIGURE 27.10 Clad outer stack-up (eight layer internal layer image, etch, strip, and oxide pro- ML-PWB) multilayer board design with the outcessing steps; then the mask must be removed at erlayers formed with a clad laminate. a later point in the process so that the external details can be fabricated. The potential exists to scratch the photomask during all the handling steps, which will result in shorts or opens (depending at which point in the process the scratch occurs). 27.3.2.3 Odd-Layer Stack-Up. Sometimes, due to signal routing or the need to have a greater dielectric space, an odd-layer circuit is formed. Similar in characteristics to the clad stack-up, the odd-layer construction technique employs a non-imaged single-sided clad laminate. Material can be procured with a single side, but a warning is associated with its use due to a lack of bondability. When this material is manufactured at the laminator supplier with only copper on one side, a release sheet is used against the non-copper side. The release sheet produces a slick, smooth surface. The non-copper surface thus requires an aggressive surface preparation to promote bondability. One alternative to gain the same benefit of the single-sided clad is to etch the copper off one side of a double-sided clad. The etched side becomes the bond surface, which has greater adhesion due to the copper tooth imprint left behind. See Fig. 27.11 for an example of a balanced odd-layer construction.

The purpose of the drive system is to provide motion at the required rate In this section, the evolution of the drive systems from the nut and screw transmission to the linear motor drives is clearly illustrated The conventional machines usually apply the nut and screw transmission system, which is sometimes known as a lead screw system with its improved form using recirculating balls In precision and ultraprecision machines, the friction drive and linear motor drive are more suitable

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Some of the uses of the single-sided odd-layer stack-up are: Odd-layer construction option The single-sided construction technique allows an opportunity to supply a layer for circuit designs having an odd layer count. Odd-layer core balance One of the problems associated with a build-up of odd-layer circuits is the ability to maintain a balanced construction of the cores. Depending on the overall design thickness and layer count, this can become a major concern to reduce warping. Figure 27.11 depicts an example of an odd-layer stack-up with three equal core thicknesses.

The output compare registers are 16-bit read/write registers. The Timer/Counter1 Output Compare Registers contain the data to be continuously compared with Timer/Counter1. Actions on compare matches are specified in the Timer/Counter1 Control and Status register. A compare match only occurs if Timer/Counter1 counts to the OCR value. A software write that sets TCNT1 and OCR1A or OCR1B to the same value does not generate a compare match. A compare match will set the compare interrupt flag in the CPU clock cycle following the compare event. Since the Output Compare Registers OCR1A and OCR1B are 16bit registers, a temporary register TEMP is used when OCR1A/B are written to ensure that both bytes are updated simultaneously. When the CPU writes the high byte, OCR1AH or OCR1BH, the data is temporarily stored in the TEMP register. When the CPU writes the low byte, OCR1AL or OCR1BL, the TEMP register is simultaneously written to OCR1AH or OCR1BH. Consequently, the high byte OCR1AH or OCR1BH must be written first for a full 16-bit register write operation. The TEMP register is also used when accessing TCNT1 and ICR1. If the main program and interrupt routines perform access to registers using TEMP, interrupts must be disabled during access from the main program and from interrupt routines if interrupts are allowed from within interrupt routines.

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